Metrology and inspection
MetaPAM — metal film-thickness metrology
The 2025 annual-report summary names MetaPAM as Jingce's metal film-thickness metrology platform.
Source checkedCN_FILING_JINGCE_2025
Metrology and inspection
SCALE EPI — epitaxial-layer thickness metrology
The 2025 annual-report summary names SCALE EPI as Jingce's epitaxial-layer thickness metrology platform.
Source checkedCN_FILING_JINGCE_2025
Metrology and inspection
eMetric — e-beam CD metrology
The 2025 annual-report summary names eMetric as Jingce's e-beam critical-dimension metrology platform.
Source checkedCN_FILING_JINGCE_2025
Metrology and inspection
eView / eVC / eSpec — e-beam defect review
The 2025 annual-report summary names eView, eVC, and eSpec as Jingce's e-beam defect-review platforms.
Source checkedCN_FILING_JINGCE_2025
Metrology and inspection
BFI — bright-field inspection
The 2025 annual-report summary names BFI as Jingce's bright-field inspection platform.
Source checkedCN_FILING_JINGCE_2025
Metrology and inspection
VEGA — dark-field defect inspection
The 2025 annual-report summary names VEGA as Jingce's dark-field defect inspection platform.
Source checkedCN_FILING_JINGCE_2025